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Antioxidant joint compound and method for forming an electrical connection [10/13/2009 ]

 

PUB. NUMBER  

EP2107643

Appl. Data  

EP2009250829A 20090324

 

PANDUIT CORP

 

Sokol, Robert L.

 

Haczynski, Christopher R.

TITLE  

Antioxidant joint compound and method for forming an electrical connection

ABSTRACT  

A joint compound for electrical connections is disclosed which includes an antioxidant base material and a quantity of stainless steel grit mixed with the antioxidant base material to provide improved mechanical pullout strength. The joint compound has a weight ratio of antioxidant to stainless steel grit in the range of from about 30:70 to about 90:10, preferably, from about 40:60 to about 70:30, and more preferably about 50:50. The stainless steel grit is cut wire having a diameter within the range of from about 0.3048 mm to about 3.17 mm, with a preferred diameter within the range of from about 0.304 mm to about 0.762 mm, and 0.431 mm being a more preferred stainless steel grit diameter.In a method for forming an electrical connection between electrical components, a joint compound as described is applied to mating surfaces of either a suitable connector, the components to be coupled together, or both. The connector is then crimped to the components, for example a wire and grounding rod, such that the joint compound is sandwiched between mating surfaces of the components and the grit penetrates the mating surfaces.

If you would like to purchase a copy of this patent, please call MicroPatent at 800-648-6787.

<<Micropatent LLC -- 10/13/2009>>

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